When the sample location cannot be inspected using external appearance related metrology tools, X-Ray imaging can be used to detect the internal structure of the sample due to its intensity change as a function of material density. This contrast image can show the internal structure of the sample without any physical destruction to the diagnosed region.
Major Application:
- Defect inspection in IC packaging: layer delamination, burst Crack, void, and bonding inspection
- Potential defects in the PCB manufacturing process, e.g. mis-alignment, bridge or open circuit.
- SMT soldering void inspection and measurement.
- Defect inspection of open, short or abnormal connections in the interconnection area
- Solder ball array inspection in BGA packaging and flip chip packaging.
- Inspection of crack in high density plastic material or void in metal.
- Chip dimension measurement, wire arc measurement, soldering percentage measurement.
Equipment limitation:
Aluminum wires or low density materials used in IC packaging are not applicable to X-Ray inspection.
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