An X-Ray is produced using a cathode ray tube to generate high energy electrons to collide with a metal target. The energy of the electrons is converted into X-Ray during the collision with metal target. The X-Ray has very short wave length and high electromagnetic radiation. 

When the sample location cannot be inspected using external appearance related metrology tools, X-Ray imaging can be used to detect the internal structure of the sample due to its intensity change as a function of material density. This contrast image can show the internal structure of the sample without any physical destruction to the diagnosed region. 

Major Application:
  • Defect inspection in IC packaging: layer delamination, burst Crack, void, and bonding inspection
  • Potential defects in the PCB manufacturing process, e.g. mis-alignment, bridge or open circuit. 
  • SMT soldering void inspection and measurement. 
  • Defect inspection of open, short or abnormal connections in the interconnection area
  • Solder ball array inspection in BGA packaging and flip chip packaging.
  • Inspection of crack in high density plastic material or void in metal.
  • Chip dimension measurement, wire arc measurement, soldering percentage measurement.

Equipment limitation:
Aluminum wires or low density materials used in IC packaging are not applicable to X-Ray inspection.

 

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